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25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB
1.Introduction of 25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB
3in1Release Film is suitable for filling and covering during the compression or lamination process of soft and hard circuit board (Rigid and Flexible PCB/RF-PCB).
Model |
Thickness |
Structure |
Surface finish |
ESRF-3in1 |
25-500um |
3 layers
|
Matte or glossy |
2. Product structure of 25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB
l Release layer
l Covering layer
l Release layer
3. Product features of 25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB
1). It has better temperature resistance.
2). Itcan meet the height difference of different soft and hard boards.
3).It features better dimensional expansion and contraction stability after compression or lamination.
4). It can match with different specifications and sizes of core layers.
4. Technical parameter of 25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB
1)Model:ESRF-3in1
2)Thickness:25-500um
3)Structure:3 layers
4)Surface finish:Matte or glossy