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Eaststar New Material (Tianjin) Limited

Eaststar New Material (Tianjin) Limited

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1 Years
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Home / Products / Hot Press Cushion Pad / Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance /

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Eaststar New Material (Tianjin) Limited
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City:tianjin
Province/State:tianjin
Country/Region:china
Contact Person:MrElon Bin
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Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
  • Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
  • Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
Products Detailed
Product Description: The Hot Press Cushion Pad is an essential accessory designed specifically for the PCB laminating process, providing excellent ...
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